Claritycap’s unique CopperConnect technology addresses a hitherto under explored area of audio capacitor performance.
Dielectric, electrode and lead wire materials have all been extensively optimised over the years.
Connection of capacitor electrodes to the leads has always relied on thermal arc spray of tin-zinc, which results in hundreds of thousands of oxidised grain boundaries introducing; distortion and phase shifts at boundary crossings and increasing propagation impedance with diameter.
CopperConnect technology introduces an embedded copper lattice to the end connection, dramatically reducing grain boundary crossings and signal path resistance, freeing capacitor designs achieve new levels of audio performance.
Taking inspiration from the highly regarded MR range, the CMR employs the same micro-phonics series film construction and acrylic tube damping.
CopperConnect technology dramatically reduces grain boundary crossings in the end connection and enables designs to employ narrower films for reduced capacitor ESR without introducing the corollary increase in end connection impedance.
The philosophy of eliminating as many crystal boundaries as possible is extended to the use of premium grade 1.0mm2 tinned oxygen free copper leads.
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